芯片及器件专用材料成分分析
微谱芯片及器件领域技术服务
服务简述:芯片及器件专用材料的成分及含量直接影响产品的研发、生产、质控及应用,因此产品中成分剖析和监控至关重要,微谱拥有强大的仪器平台和数据库,经验丰富的专业技术团队,针对电子材料产品中与成分相关的各种难题,为客户提供完善的解决方案。
服务内容
1.1高分子橡塑、胶粘剂、油墨、涂料成分分析Polymer Compositional Analysis of Rubbers, Plastics, Adhesives, Inks and Paints
|
玻纤布分析 |
Fiberglass Fabric |
|
基板材料分析 |
Substrate Material |
|
酚醛树脂分析 |
Phenolic Resin |
|
环氧树脂分析 |
Epoxy Resin |
|
聚酰亚胺分析 |
Polyimide |
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聚四氟乙烯PTFE分析 |
Polytetrafluoroethylene PTFE |
|
半固化片PP分析 |
Prepreg |
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粘结材料分析 |
Adhesive Materials |
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导热硅脂分析 |
Thermal Conductive Silicone Grease |
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感光材料分析 |
Photosensitive Material |
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湿膜和干膜分析 |
Wet Film and Dry Film |
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防焊漆(油墨)分析 |
Solder Resistant Paint (Ink) |
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三防漆分析 |
Three Proof Paint/Conformal Coating |
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IC芯片底部填充胶分析 |
IC Chip Bottom Filling Adhesive |
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胶粘剂分析 |
Adhesive |
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红胶分析 |
Red Gum |
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底片分析 |
Negative Film Analysis |
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高分子中指定树脂定性定量分析 |
Qualitative and Quantitative Analysis of Specified Resin in Polymer |
|
树脂结构解析 |
Structural Analysis of Resin |
|
聚合物结构解析 |
Structure Analysis of Polymer |
|
光刻胶分析 |
Photoresist analysis |
|
掩模版分析 |
Mask analysis |
|
晶圆封装材料分析 |
Wafer packaging material analysis |
1.2无机材料及电子化学品Composition Analysis of Inorganic Materials and Electronic Chemicals
|
铜箔分析 |
Copper Foil |
|
陶瓷材料分析 |
Ceramic Material |
|
显影液分析 |
Developing Solution |
|
刻蚀液分析 |
Etching Solution |
|
去膜液分析 |
Film Stripping Liquid |
|
镀铜液分析 |
Copper Plating Solution |
|
绿油分析 |
Green Oil |
|
沉金液分析 |
Gold Precipitation Solution |
|
锡膏分析 |
Solder Paste |
|
助焊剂分析 |
Flux |
|
洗板水分析 |
Circuit Board Cleaner |
|
清洗剂分析 |
Cleaning Agent |
|
CMP抛光液成分分析 |
Composition analysis of CMP polishing slurry |
|
溅射靶材成分分析 |
Sputtering target composition analysis |
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红胶去除剂分析 |
Red Gum Remover |
|
水样分析 |
Water Analysis |
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土壤/固废/底泥处理助剂分析 |
Soil/Solid Waste/Sediment Treatment Additives |
|
助剂中指定成分定性定量分析 |
Qualitative and Quantitative Analysis of Specified Ingredient in Auxiliary Agents |
|
助焊剂指定松香定性定量分析 |
Qualitative and Quantitative Analysis of Specified Rosin in Flux |


